GEN-Z 1C STR

Gen-Z high-density modular connectors are next-gen board-to-board and board-to-cable interconnection solutions designed for CXL and memory pooling architectures. Widely used in AI accelerator servers, OCP modular hardware, HPC clusters, high-speed switches, FPGA modules and distributed storage equipment, they integrate high-speed signals and high-power power supply, becoming the core interconnect solution for future heterogeneous computing platforms.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1002 specification. Modular configurations include 1C/2C/4C/4C+. It integrates high-speed differential pairs, high-power power pins, ground and control circuits, supporting PCIe 5.0/6.0 and CXL protocols, with 12V & 48V high-power variants available.
2.Ultra-high-speed Performance: Designed with 85Ω differential impedance. It supports 32GT/s NRZ natively and can be upgraded to 56G/112G PAM4, maintaining stable electrical performance for long-reach wiring to meet low-latency data exchange between chips and GPU pools.
3.Controlled SI Performance: Full-enclosure metal shielding suppresses crosstalk and return loss effectively, meeting strict high-frequency simulation and testing requirements for stable long-distance transmission.
4.Multi-style Compatibility: Supports card-edge mating, board-to-board connection and cable assembly interconnection. Straight, right-angle and straddle mounting options fit backplane routing, cross-board wiring and module expansion flexibly.
5.High-density Miniaturization: 0.6mm fine pitch with multi-pin integration. It combines high-speed signals and power pins within limited space to reduce PCB footprint for slim modular equipment.
6.High Mechanical Reliability: Built-in anti-misinsertion and anti-skew locking structure prevents offset mating and ensures stable contact with long mating cycles. Operating temperature ranges from -40℃ to +85℃, with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

GEN-Z 2C STR

Gen-Z high-density modular connectors are next-gen board-to-board and board-to-cable interconnection solutions designed for CXL and memory pooling architectures. Widely used in AI accelerator servers, OCP modular hardware, HPC clusters, high-speed switches, FPGA modules and distributed storage equipment, they integrate high-speed signals and high-power power supply, becoming the core interconnect solution for future heterogeneous computing platforms.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1002 specification. Modular configurations include 1C/2C/4C/4C+. It integrates high-speed differential pairs, high-power power pins, ground and control circuits, supporting PCIe 5.0/6.0 and CXL protocols, with 12V & 48V high-power variants available.
2.Ultra-high-speed Performance: Designed with 85Ω differential impedance. It supports 32GT/s NRZ natively and can be upgraded to 56G/112G PAM4, maintaining stable electrical performance for long-reach wiring to meet low-latency data exchange between chips and GPU pools.
3.Controlled SI Performance: Full-enclosure metal shielding suppresses crosstalk and return loss effectively, meeting strict high-frequency simulation and testing requirements for stable long-distance transmission.
4.Multi-style Compatibility: Supports card-edge mating, board-to-board connection and cable assembly interconnection. Straight, right-angle and straddle mounting options fit backplane routing, cross-board wiring and module expansion flexibly.
5.High-density Miniaturization: 0.6mm fine pitch with multi-pin integration. It combines high-speed signals and power pins within limited space to reduce PCB footprint for slim modular equipment.
6.High Mechanical Reliability: Built-in anti-misinsertion and anti-skew locking structure prevents offset mating and ensures stable contact with long mating cycles. Operating temperature ranges from -40℃ to +85℃, with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

GEN-Z 4C+ LE

Gen-Z high-density modular connectors are next-gen board-to-board and board-to-cable interconnection solutions designed for CXL and memory pooling architectures. Widely used in AI accelerator servers, OCP modular hardware, HPC clusters, high-speed switches, FPGA modules and distributed storage equipment, they integrate high-speed signals and high-power power supply, becoming the core interconnect solution for future heterogeneous computing platforms.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1002 specification. Modular configurations include 1C/2C/4C/4C+. It integrates high-speed differential pairs, high-power power pins, ground and control circuits, supporting PCIe 5.0/6.0 and CXL protocols, with 12V & 48V high-power variants available.
2.Ultra-high-speed Performance: Designed with 85Ω differential impedance. It supports 32GT/s NRZ natively and can be upgraded to 56G/112G PAM4, maintaining stable electrical performance for long-reach wiring to meet low-latency data exchange between chips and GPU pools.
3.Controlled SI Performance: Full-enclosure metal shielding suppresses crosstalk and return loss effectively, meeting strict high-frequency simulation and testing requirements for stable long-distance transmission.
4.Multi-style Compatibility: Supports card-edge mating, board-to-board connection and cable assembly interconnection. Straight, right-angle and straddle mounting options fit backplane routing, cross-board wiring and module expansion flexibly.
5.High-density Miniaturization: 0.6mm fine pitch with multi-pin integration. It combines high-speed signals and power pins within limited space to reduce PCB footprint for slim modular equipment.
6.High Mechanical Reliability: Built-in anti-misinsertion and anti-skew locking structure prevents offset mating and ensures stable contact with long mating cycles. Operating temperature ranges from -40℃ to +85℃, with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

GEN-Z 4C+ RE

Gen-Z high-density modular connectors are next-gen board-to-board and board-to-cable interconnection solutions designed for CXL and memory pooling architectures. Widely used in AI accelerator servers, OCP modular hardware, HPC clusters, high-speed switches, FPGA modules and distributed storage equipment, they integrate high-speed signals and high-power power supply, becoming the core interconnect solution for future heterogeneous computing platforms.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1002 specification. Modular configurations include 1C/2C/4C/4C+. It integrates high-speed differential pairs, high-power power pins, ground and control circuits, supporting PCIe 5.0/6.0 and CXL protocols, with 12V & 48V high-power variants available.
2.Ultra-high-speed Performance: Designed with 85Ω differential impedance. It supports 32GT/s NRZ natively and can be upgraded to 56G/112G PAM4, maintaining stable electrical performance for long-reach wiring to meet low-latency data exchange between chips and GPU pools.
3.Controlled SI Performance: Full-enclosure metal shielding suppresses crosstalk and return loss effectively, meeting strict high-frequency simulation and testing requirements for stable long-distance transmission.
4.Multi-style Compatibility: Supports card-edge mating, board-to-board connection and cable assembly interconnection. Straight, right-angle and straddle mounting options fit backplane routing, cross-board wiring and module expansion flexibly.
5.High-density Miniaturization: 0.6mm fine pitch with multi-pin integration. It combines high-speed signals and power pins within limited space to reduce PCB footprint for slim modular equipment.
6.High Mechanical Reliability: Built-in anti-misinsertion and anti-skew locking structure prevents offset mating and ensures stable contact with long mating cycles. Operating temperature ranges from -40℃ to +85℃, with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

GEN-Z 4C+ STR

Gen-Z high-density modular connectors are next-gen board-to-board and board-to-cable interconnection solutions designed for CXL and memory pooling architectures. Widely used in AI accelerator servers, OCP modular hardware, HPC clusters, high-speed switches, FPGA modules and distributed storage equipment, they integrate high-speed signals and high-power power supply, becoming the core interconnect solution for future heterogeneous computing platforms.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1002 specification. Modular configurations include 1C/2C/4C/4C+. It integrates high-speed differential pairs, high-power power pins, ground and control circuits, supporting PCIe 5.0/6.0 and CXL protocols, with 12V & 48V high-power variants available.
2.Ultra-high-speed Performance: Designed with 85Ω differential impedance. It supports 32GT/s NRZ natively and can be upgraded to 56G/112G PAM4, maintaining stable electrical performance for long-reach wiring to meet low-latency data exchange between chips and GPU pools.
3.Controlled SI Performance: Full-enclosure metal shielding suppresses crosstalk and return loss effectively, meeting strict high-frequency simulation and testing requirements for stable long-distance transmission.
4.Multi-style Compatibility: Supports card-edge mating, board-to-board connection and cable assembly interconnection. Straight, right-angle and straddle mounting options fit backplane routing, cross-board wiring and module expansion flexibly.
5.High-density Miniaturization: 0.6mm fine pitch with multi-pin integration. It combines high-speed signals and power pins within limited space to reduce PCB footprint for slim modular equipment.
6.High Mechanical Reliability: Built-in anti-misinsertion and anti-skew locking structure prevents offset mating and ensures stable contact with long mating cycles. Operating temperature ranges from -40℃ to +85℃, with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

LP GEN-Z 1C RA

Gen-Z high-density modular connectors are next-gen board-to-board and board-to-cable interconnection solutions designed for CXL and memory pooling architectures. Widely used in AI accelerator servers, OCP modular hardware, HPC clusters, high-speed switches, FPGA modules and distributed storage equipment, they integrate high-speed signals and high-power power supply, becoming the core interconnect solution for future heterogeneous computing platforms.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1002 specification. Modular configurations include 1C/2C/4C/4C+. It integrates high-speed differential pairs, high-power power pins, ground and control circuits, supporting PCIe 5.0/6.0 and CXL protocols, with 12V & 48V high-power variants available.
2.Ultra-high-speed Performance: Designed with 85Ω differential impedance. It supports 32GT/s NRZ natively and can be upgraded to 56G/112G PAM4, maintaining stable electrical performance for long-reach wiring to meet low-latency data exchange between chips and GPU pools.
3.Controlled SI Performance: Full-enclosure metal shielding suppresses crosstalk and return loss effectively, meeting strict high-frequency simulation and testing requirements for stable long-distance transmission.
4.Multi-style Compatibility: Supports card-edge mating, board-to-board connection and cable assembly interconnection. Straight, right-angle and straddle mounting options fit backplane routing, cross-board wiring and module expansion flexibly.
5.High-density Miniaturization: 0.6mm fine pitch with multi-pin integration. It combines high-speed signals and power pins within limited space to reduce PCB footprint for slim modular equipment.
6.High Mechanical Reliability: Built-in anti-misinsertion and anti-skew locking structure prevents offset mating and ensures stable contact with long mating cycles. Operating temperature ranges from -40℃ to +85℃, with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

LP GEN-Z 1C STR

Gen-Z high-density modular connectors are next-gen board-to-board and board-to-cable interconnection solutions designed for CXL and memory pooling architectures. Widely used in AI accelerator servers, OCP modular hardware, HPC clusters, high-speed switches, FPGA modules and distributed storage equipment, they integrate high-speed signals and high-power power supply, becoming the core interconnect solution for future heterogeneous computing platforms.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1002 specification. Modular configurations include 1C/2C/4C/4C+. It integrates high-speed differential pairs, high-power power pins, ground and control circuits, supporting PCIe 5.0/6.0 and CXL protocols, with 12V & 48V high-power variants available.
2.Ultra-high-speed Performance: Designed with 85Ω differential impedance. It supports 32GT/s NRZ natively and can be upgraded to 56G/112G PAM4, maintaining stable electrical performance for long-reach wiring to meet low-latency data exchange between chips and GPU pools.
3.Controlled SI Performance: Full-enclosure metal shielding suppresses crosstalk and return loss effectively, meeting strict high-frequency simulation and testing requirements for stable long-distance transmission.
4.Multi-style Compatibility: Supports card-edge mating, board-to-board connection and cable assembly interconnection. Straight, right-angle and straddle mounting options fit backplane routing, cross-board wiring and module expansion flexibly.
5.High-density Miniaturization: 0.6mm fine pitch with multi-pin integration. It combines high-speed signals and power pins within limited space to reduce PCB footprint for slim modular equipment.
6.High Mechanical Reliability: Built-in anti-misinsertion and anti-skew locking structure prevents offset mating and ensures stable contact with long mating cycles. Operating temperature ranges from -40℃ to +85℃, with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

LP GEN-Z 2C RA

Gen-Z high-density modular connectors are next-gen board-to-board and board-to-cable interconnection solutions designed for CXL and memory pooling architectures. Widely used in AI accelerator servers, OCP modular hardware, HPC clusters, high-speed switches, FPGA modules and distributed storage equipment, they integrate high-speed signals and high-power power supply, becoming the core interconnect solution for future heterogeneous computing platforms.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1002 specification. Modular configurations include 1C/2C/4C/4C+. It integrates high-speed differential pairs, high-power power pins, ground and control circuits, supporting PCIe 5.0/6.0 and CXL protocols, with 12V & 48V high-power variants available.
2.Ultra-high-speed Performance: Designed with 85Ω differential impedance. It supports 32GT/s NRZ natively and can be upgraded to 56G/112G PAM4, maintaining stable electrical performance for long-reach wiring to meet low-latency data exchange between chips and GPU pools.
3.Controlled SI Performance: Full-enclosure metal shielding suppresses crosstalk and return loss effectively, meeting strict high-frequency simulation and testing requirements for stable long-distance transmission.
4.Multi-style Compatibility: Supports card-edge mating, board-to-board connection and cable assembly interconnection. Straight, right-angle and straddle mounting options fit backplane routing, cross-board wiring and module expansion flexibly.
5.High-density Miniaturization: 0.6mm fine pitch with multi-pin integration. It combines high-speed signals and power pins within limited space to reduce PCB footprint for slim modular equipment.
6.High Mechanical Reliability: Built-in anti-misinsertion and anti-skew locking structure prevents offset mating and ensures stable contact with long mating cycles. Operating temperature ranges from -40℃ to +85℃, with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

LP GEN-Z 2C STR

Gen-Z high-density modular connectors are next-gen board-to-board and board-to-cable interconnection solutions designed for CXL and memory pooling architectures. Widely used in AI accelerator servers, OCP modular hardware, HPC clusters, high-speed switches, FPGA modules and distributed storage equipment, they integrate high-speed signals and high-power power supply, becoming the core interconnect solution for future heterogeneous computing platforms.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1002 specification. Modular configurations include 1C/2C/4C/4C+. It integrates high-speed differential pairs, high-power power pins, ground and control circuits, supporting PCIe 5.0/6.0 and CXL protocols, with 12V & 48V high-power variants available.
2.Ultra-high-speed Performance: Designed with 85Ω differential impedance. It supports 32GT/s NRZ natively and can be upgraded to 56G/112G PAM4, maintaining stable electrical performance for long-reach wiring to meet low-latency data exchange between chips and GPU pools.
3.Controlled SI Performance: Full-enclosure metal shielding suppresses crosstalk and return loss effectively, meeting strict high-frequency simulation and testing requirements for stable long-distance transmission.
4.Multi-style Compatibility: Supports card-edge mating, board-to-board connection and cable assembly interconnection. Straight, right-angle and straddle mounting options fit backplane routing, cross-board wiring and module expansion flexibly.
5.High-density Miniaturization: 0.6mm fine pitch with multi-pin integration. It combines high-speed signals and power pins within limited space to reduce PCB footprint for slim modular equipment.
6.High Mechanical Reliability: Built-in anti-misinsertion and anti-skew locking structure prevents offset mating and ensures stable contact with long mating cycles. Operating temperature ranges from -40℃ to +85℃, with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

LP GEN-Z 4C RA

Gen-Z high-density modular connectors are next-gen board-to-board and board-to-cable interconnection solutions designed for CXL and memory pooling architectures. Widely used in AI accelerator servers, OCP modular hardware, HPC clusters, high-speed switches, FPGA modules and distributed storage equipment, they integrate high-speed signals and high-power power supply, becoming the core interconnect solution for future heterogeneous computing platforms.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1002 specification. Modular configurations include 1C/2C/4C/4C+. It integrates high-speed differential pairs, high-power power pins, ground and control circuits, supporting PCIe 5.0/6.0 and CXL protocols, with 12V & 48V high-power variants available.
2.Ultra-high-speed Performance: Designed with 85Ω differential impedance. It supports 32GT/s NRZ natively and can be upgraded to 56G/112G PAM4, maintaining stable electrical performance for long-reach wiring to meet low-latency data exchange between chips and GPU pools.
3.Controlled SI Performance: Full-enclosure metal shielding suppresses crosstalk and return loss effectively, meeting strict high-frequency simulation and testing requirements for stable long-distance transmission.
4.Multi-style Compatibility: Supports card-edge mating, board-to-board connection and cable assembly interconnection. Straight, right-angle and straddle mounting options fit backplane routing, cross-board wiring and module expansion flexibly.
5.High-density Miniaturization: 0.6mm fine pitch with multi-pin integration. It combines high-speed signals and power pins within limited space to reduce PCB footprint for slim modular equipment.
6.High Mechanical Reliability: Built-in anti-misinsertion and anti-skew locking structure prevents offset mating and ensures stable contact with long mating cycles. Operating temperature ranges from -40℃ to +85℃, with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

LP GEN-Z 4C STR

Gen-Z high-density modular connectors are next-gen board-to-board and board-to-cable interconnection solutions designed for CXL and memory pooling architectures. Widely used in AI accelerator servers, OCP modular hardware, HPC clusters, high-speed switches, FPGA modules and distributed storage equipment, they integrate high-speed signals and high-power power supply, becoming the core interconnect solution for future heterogeneous computing platforms.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1002 specification. Modular configurations include 1C/2C/4C/4C+. It integrates high-speed differential pairs, high-power power pins, ground and control circuits, supporting PCIe 5.0/6.0 and CXL protocols, with 12V & 48V high-power variants available.
2.Ultra-high-speed Performance: Designed with 85Ω differential impedance. It supports 32GT/s NRZ natively and can be upgraded to 56G/112G PAM4, maintaining stable electrical performance for long-reach wiring to meet low-latency data exchange between chips and GPU pools.
3.Controlled SI Performance: Full-enclosure metal shielding suppresses crosstalk and return loss effectively, meeting strict high-frequency simulation and testing requirements for stable long-distance transmission.
4.Multi-style Compatibility: Supports card-edge mating, board-to-board connection and cable assembly interconnection. Straight, right-angle and straddle mounting options fit backplane routing, cross-board wiring and module expansion flexibly.
5.High-density Miniaturization: 0.6mm fine pitch with multi-pin integration. It combines high-speed signals and power pins within limited space to reduce PCB footprint for slim modular equipment.
6.High Mechanical Reliability: Built-in anti-misinsertion and anti-skew locking structure prevents offset mating and ensures stable contact with long mating cycles. Operating temperature ranges from -40℃ to +85℃, with strong vibration and EMI resistance for 7×24 continuous operation in data centers.