Products
With innovative development technologies, superior quality, and competitive manufacturing cost, our products have been used for wireless applications including GPRS, WLAN, Bluetooth, Wi-Fi, CATV, GPS, satellite communication, base station, RF modules, high-frequency measurement equipment, as well as consumer products such as antennas, mobile phones, medical devices, home electronics, and RFID, etc.
Auto Connector
Antenna
MINI RF
USS RF
SCS RF
SMA、MCX
BTB Connector
FPC Connector
FPC Board
WTB
High-speed Cables
Precision Metals
Type C
SlimSAS 4I & 8I SlimSAS 4I & 8I 防斜插 SlimSAS 4I & 8I防斜插WPULLTAB
Designed for PCIe high-speed interconnection scenarios, the OCULINK series high-speed connectors are widely applied in AI edge computing devices, high-performance servers, NVMe high-speed solid-state storage, external graphics card expansion and high-speed industrial control equipment interconnection. They serve as a mainstream high-speed interconnection solution for next-generation high-density and high-bandwidth computing and storage devices.
Product Features:
1. Standard Compliance: Fully compliant with SFF-8611/SFF-8612 industry specifications and PCI-SIG standards. The connector integrates high-speed differential signals, power supplies and auxiliary signal circuits, compatible with PCIe and SAS high-speed protocols, and features strong compatibility with various high-end computing and high-speed storage hardware.
2. Ultra-high Bandwidth: Natively supports PCIe 4.0 high-speed transmission with a single-lane rate of 16GT/s and a maximum total bandwidth of 64Gbps for four lanes. It is also compatible with SAS 4.0 and ensures stable long-cable transmission, meeting the real-time interaction requirements of ultra-high bandwidth data.
3. Excellent SI Performance: Adopting an industry-standard 85Ω differential impedance design with a precision shielding structure, it effectively reduces crosstalk and return loss. It delivers outstanding signal integrity and fully meets the simulation and testing indicators for high-frequency and high-speed transmission.
4. Multi-scenario Compatibility: It supports both internal board-to-board interconnection and external cable extended connection, flexibly adapting to NVMe SSD direct connection, external GPU expansion, high-speed storage array expansion and other scenarios with strong equipment adaptability.
5. Micro High-density Design: Adopting a compact structure with 0.5mm ultra-fine pitch and multiple wiring outlet angles, it greatly saves PCB layout and chassis space, perfectly fitting the miniaturization and high-density design of high-end computing devices.
6. High Reliability: Equipped with an anti-misinsertion locking structure for accurate insertion and stable contact with excellent plugging lifespan. It supports a wide operating temperature range of -40℃ to +85℃ and features superior vibration and electromagnetic interference resistance, enabling 7×24-hour long-term stable operation of high-end equipment.
Designed for PCIe high-speed interconnection scenarios, the OCULINK series high-speed connectors are widely applied in AI edge computing devices, high-performance servers, NVMe high-speed solid-state storage, external graphics card expansion and high-speed industrial control equipment interconnection. They serve as a mainstream high-speed interconnection solution for next-generation high-density and high-bandwidth computing and storage devices.
Product Features:
1. Standard Compliance: Fully compliant with SFF-8611/SFF-8612 industry specifications and PCI-SIG standards. The connector integrates high-speed differential signals, power supplies and auxiliary signal circuits, compatible with PCIe and SAS high-speed protocols, and features strong compatibility with various high-end computing and high-speed storage hardware.
2. Ultra-high Bandwidth: Natively supports PCIe 4.0 high-speed transmission with a single-lane rate of 16GT/s and a maximum total bandwidth of 64Gbps for four lanes. It is also compatible with SAS 4.0 and ensures stable long-cable transmission, meeting the real-time interaction requirements of ultra-high bandwidth data.
3. Excellent SI Performance: Adopting an industry-standard 85Ω differential impedance design with a precision shielding structure, it effectively reduces crosstalk and return loss. It delivers outstanding signal integrity and fully meets the simulation and testing indicators for high-frequency and high-speed transmission.
4. Multi-scenario Compatibility: It supports both internal board-to-board interconnection and external cable extended connection, flexibly adapting to NVMe SSD direct connection, external GPU expansion, high-speed storage array expansion and other scenarios with strong equipment adaptability.
5. Micro High-density Design: Adopting a compact structure with 0.5mm ultra-fine pitch and multiple wiring outlet angles, it greatly saves PCB layout and chassis space, perfectly fitting the miniaturization and high-density design of high-end computing devices.
6. High Reliability: Equipped with an anti-misinsertion locking structure for accurate insertion and stable contact with excellent plugging lifespan. It supports a wide operating temperature range of -40℃ to +85℃ and features superior vibration and electromagnetic interference resistance, enabling 7×24-hour long-term stable operation of high-end equipment.
