GEN-Z 4C+ LE
GEN-Z 4C+ LE,L30.17mm*W70.4mm*H15.66mm
| Assembly Method | Vertical | Pin Count |
| Number of Rows | （Single Port） | 168 pins |
| CONNECTOR Housing: High Temp PA66+30%G/F |
| Plating | Nickel + Gold | Terminal Base Material | EM888S |
| Terminal Layout | Straight Plug-in | Terminal Shape & Structure | / |
| Terminal Plating Specification | Gold plating thickness:Solder area: 1u~3u Contact area: 30u~50u |
Terminal Type | / |
| / |
| Packaging Technology | Anti-misinsertion locking structure with SMD surface-mount packaging | ||
| UL Flammability Rating | UL94V-0 | ||
| Packaging Method | Individual packing | ||
| Length | 30.17 | Width | 70.4 |
| Height | 15.66 |
| Data Rate Requirement | PCIE 5.0 32Gbps. |
| Dielectric Withstanding Voltage | 500V DC/min |
| Operating Voltage | 30V DC |
| Connector System | Wire-to-Board |
| Operating Temperature | -20 ℃~+80 ℃ |
GEN-Z 4C+ LE 
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