Products
With innovative development technologies, superior quality, and competitive manufacturing cost, our products have been used for wireless applications including GPRS, WLAN, Bluetooth, Wi-Fi, CATV, GPS, satellite communication, base station, RF modules, high-frequency measurement equipment, as well as consumer products such as antennas, mobile phones, medical devices, home electronics, and RFID, etc.
Auto Connector
Antenna
MINI RF
USS RF
SCS RF
SMA、MCX
BTB Connector
FPC Connector
FPC Board
WTB
High-speed Cables
Precision Metals
Type C
SlimSAS 4I & 8I SlimSAS 4I & 8I 防斜插 SlimSAS 4I & 8I防斜插WPULLTAB
Widely used in AI computing servers, HPC high-performance computing, enterprise high-speed storage arrays, RAID disk modules, and internal interconnection of industrial control accelerator cards, the HD MINISAS series high-speed connectors serve as the preferred high-speed interconnection solution for storage and computing in next-generation high-density data centers.
Product Features:
1. Standard Compliance: Compliant with SFF-8643/8644/8086 industry specifications, it adopts a 4-lane high-speed transmission architecture. The terminals integrate high-speed signals, power supplies, ground wires and auxiliary signal circuits, delivering high compatibility with mainstream server and storage hardware.
2. High-Speed Performance: Natively supporting the SAS 3.0 protocol, it provides a single-lane bandwidth of 12Gbps and a maximum total bandwidth of 48Gbps for four lanes. It ensures stable long-distance transmission and meets the requirements of high-speed data reading and writing as well as high-frequency data interaction of computing clusters.
3. Controlled Signal Integrity: Adopting a standard 100Ω differential impedance design with precision shielding structure, it features low return loss and low crosstalk, delivering excellent signal integrity and complying with high-speed transmission simulation indicators.
4. Multi-functional Design: A single connector supports both board-to-board direct connection and cable assembly interconnection, adapting to diverse wiring scenarios and various equipment architectures flexibly.
5. Compact and Miniaturized: Significantly smaller in size than traditional SAS connectors with multiple wiring outlet options, it saves chassis and PCB space and is well suited for wiring design of high-density equipment.
6. High-Reliability Structure: Equipped with an anti-misalignment locking structure for stable contact and excellent plugging service life. It supports a wide operating temperature range from -40℃ to +85℃ with vibration and interference resistance, enabling long-term continuous operation in data center scenarios.
Widely used in AI computing servers, HPC high-performance computing, enterprise high-speed storage arrays, RAID disk modules, and internal interconnection of industrial control accelerator cards, the HD MINISAS series high-speed connectors serve as the preferred high-speed interconnection solution for storage and computing in next-generation high-density data centers.
Product Features:
1. Standard Compliance: Compliant with SFF-8643/8644/8086 industry specifications, it adopts a 4-lane high-speed transmission architecture. The terminals integrate high-speed signals, power supplies, ground wires and auxiliary signal circuits, delivering high compatibility with mainstream server and storage hardware.
2. High-Speed Performance: Natively supporting the SAS 3.0 protocol, it provides a single-lane bandwidth of 12Gbps and a maximum total bandwidth of 48Gbps for four lanes. It ensures stable long-distance transmission and meets the requirements of high-speed data reading and writing as well as high-frequency data interaction of computing clusters.
3. Controlled Signal Integrity: Adopting a standard 100Ω differential impedance design with precision shielding structure, it features low return loss and low crosstalk, delivering excellent signal integrity and complying with high-speed transmission simulation indicators.
4. Multi-functional Design: A single connector supports both board-to-board direct connection and cable assembly interconnection, adapting to diverse wiring scenarios and various equipment architectures flexibly.
5. Compact and Miniaturized: Significantly smaller in size than traditional SAS connectors with multiple wiring outlet options, it saves chassis and PCB space and is well suited for wiring design of high-density equipment.
6. High-Reliability Structure: Equipped with an anti-misalignment locking structure for stable contact and excellent plugging service life. It supports a wide operating temperature range from -40℃ to +85℃ with vibration and interference resistance, enabling long-term continuous operation in data center scenarios.
Widely used in AI computing servers, HPC high-performance computing, enterprise high-speed storage arrays, RAID disk modules, and internal interconnection of industrial control accelerator cards, the HD MINISAS series high-speed connectors serve as the preferred high-speed interconnection solution for storage and computing in next-generation high-density data centers.
Product Features:
1. Standard Compliance: Compliant with SFF-8643/8644/8086 industry specifications, it adopts a 4-lane high-speed transmission architecture. The terminals integrate high-speed signals, power supplies, ground wires and auxiliary signal circuits, delivering high compatibility with mainstream server and storage hardware.
2. High-Speed Performance: Natively supporting the SAS 3.0 protocol, it provides a single-lane bandwidth of 12Gbps and a maximum total bandwidth of 48Gbps for four lanes. It ensures stable long-distance transmission and meets the requirements of high-speed data reading and writing as well as high-frequency data interaction of computing clusters.
3. Controlled Signal Integrity: Adopting a standard 100Ω differential impedance design with precision shielding structure, it features low return loss and low crosstalk, delivering excellent signal integrity and complying with high-speed transmission simulation indicators.
4. Multi-functional Design: A single connector supports both board-to-board direct connection and cable assembly interconnection, adapting to diverse wiring scenarios and various equipment architectures flexibly.
5. Compact and Miniaturized: Significantly smaller in size than traditional SAS connectors with multiple wiring outlet options, it saves chassis and PCB space and is well suited for wiring design of high-density equipment.
6. High-Reliability Structure: Equipped with an anti-misalignment locking structure for stable contact and excellent plugging service life. It supports a wide operating temperature range from -40℃ to +85℃ with vibration and interference resistance, enabling long-term continuous operation in data center scenarios.
Widely used in AI computing servers, HPC high-performance computing, enterprise high-speed storage arrays, RAID disk modules, and internal interconnection of industrial control accelerator cards, the HD MINISAS series high-speed connectors serve as the preferred high-speed interconnection solution for storage and computing in next-generation high-density data centers.
Product Features:
1. Standard Compliance: Compliant with SFF-8643/8644/8086 industry specifications, it adopts a 4-lane high-speed transmission architecture. The terminals integrate high-speed signals, power supplies, ground wires and auxiliary signal circuits, delivering high compatibility with mainstream server and storage hardware.
2. High-Speed Performance: Natively supporting the SAS 3.0 protocol, it provides a single-lane bandwidth of 12Gbps and a maximum total bandwidth of 48Gbps for four lanes. It ensures stable long-distance transmission and meets the requirements of high-speed data reading and writing as well as high-frequency data interaction of computing clusters.
3. Controlled Signal Integrity: Adopting a standard 100Ω differential impedance design with precision shielding structure, it features low return loss and low crosstalk, delivering excellent signal integrity and complying with high-speed transmission simulation indicators.
4. Multi-functional Design: A single connector supports both board-to-board direct connection and cable assembly interconnection, adapting to diverse wiring scenarios and various equipment architectures flexibly.
5. Compact and Miniaturized: Significantly smaller in size than traditional SAS connectors with multiple wiring outlet options, it saves chassis and PCB space and is well suited for wiring design of high-density equipment.
6. High-Reliability Structure: Equipped with an anti-misalignment locking structure for stable contact and excellent plugging service life. It supports a wide operating temperature range from -40℃ to +85℃ with vibration and interference resistance, enabling long-term continuous operation in data center scenarios.
Widely used in AI computing servers, HPC high-performance computing, enterprise high-speed storage arrays, RAID disk modules, and internal interconnection of industrial control accelerator cards, the HD MINISAS series high-speed connectors serve as the preferred high-speed interconnection solution for storage and computing in next-generation high-density data centers.
Product Features:
1. Standard Compliance: Compliant with SFF-8643/8644/8086 industry specifications, it adopts a 4-lane high-speed transmission architecture. The terminals integrate high-speed signals, power supplies, ground wires and auxiliary signal circuits, delivering high compatibility with mainstream server and storage hardware.
2. High-Speed Performance: Natively supporting the SAS 3.0 protocol, it provides a single-lane bandwidth of 12Gbps and a maximum total bandwidth of 48Gbps for four lanes. It ensures stable long-distance transmission and meets the requirements of high-speed data reading and writing as well as high-frequency data interaction of computing clusters.
3. Controlled Signal Integrity: Adopting a standard 100Ω differential impedance design with precision shielding structure, it features low return loss and low crosstalk, delivering excellent signal integrity and complying with high-speed transmission simulation indicators.
4. Multi-functional Design: A single connector supports both board-to-board direct connection and cable assembly interconnection, adapting to diverse wiring scenarios and various equipment architectures flexibly.
5. Compact and Miniaturized: Significantly smaller in size than traditional SAS connectors with multiple wiring outlet options, it saves chassis and PCB space and is well suited for wiring design of high-density equipment.
6. High-Reliability Structure: Equipped with an anti-misalignment locking structure for stable contact and excellent plugging service life. It supports a wide operating temperature range from -40℃ to +85℃ with vibration and interference resistance, enabling long-term continuous operation in data center scenarios.
MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.
MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.
