MCIO 4I LE

MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

MCIO 4I LE WITH PULL TAB

MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

MCIO 4I RA

MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

MCIO 4I RA WITH PULL TAB

MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

MCIO 4I RA WITH PULL TAB anti-skew

MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

MCIO 4I RE

MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

MCIO 4I RE WITH PULL TAB

MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

MCIO 4I STR

MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

MCIO 4I STR WITH PULL TAB

MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

MCIO 8I LE

MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

MCIO 8I LE WITH PULL TAB

MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.

MCIO 8I LE WITH PULL TAB anti-skew

MCIO (Mini Cool Edge IO) high-density high-speed connectors are new-generation board-to-cable edge interconnect solutions designed for PCIe 5.0/6.0 and CXL architectures. Widely used in AI accelerator servers, OCP modular platforms, EDSFF high-speed SSD modules, GPU interconnections, high-performance storage arrays and cloud computing hardware, they become the mainstream internal interconnect for high-density liquid-cooled servers with ultra-small size and ultra-high bandwidth.
Product Features:
1.Standard Compliance: Fully compliant with SFF-TA-1016 specification. It offers 4X/8X/16X multi-lane configurations, integrating high-speed differential pairs, power, ground and control circuits. Natively supporting PCIe Gen5/Gen6 and CXL, it has excellent hardware compatibility.
2.Ultra-high Bandwidth: Supports 32GT/s NRZ and 64G PAM4 signals with low signal loss on long cables, delivering stable transmission and meeting low-latency mass data exchange for GPU clusters and high-speed solid-state storage.
3.Controlled SI Performance: Designed with 85Ω differential impedance and integrated metal shielding housing to reduce crosstalk and return loss, meeting strict high-frequency simulation and test requirements.
4.Multi-scenario Compatibility: One connector supports both card-edge mating and cable assembly interconnection. Vertical, right-angle and side-exit versions are available for cross-board wiring, module expansion and internal high-speed links.
5.Compact High-density Structure: 0.6mm fine pitch with much smaller footprint than HD MINISAS. It greatly reduces PCB space and chassis thickness for slim high-density modular equipment.
6.High Mechanical Reliability: Built with anti-misinsertion and anti-skew locking structure to avoid mis-mating and offset plugging. It operates reliably from -40℃ to +85℃ with strong vibration and EMI resistance for 7×24 continuous operation in data centers.