Omni Edge 8I RA

OmniEdge high-speed board-to-cable connectors are next-gen ultra-high-density interconnection solutions for AI computing platforms. They are widely deployed inside AI servers, OCP modular hardware, HPC clusters, high-speed storage arrays and GPU accelerator modules. Supporting seamless upgrade from PCIe Gen5 to Gen6, they become the preferred internal interconnect for high-density liquid-cooled data centers.
Product Features:
1.Standard Compatibility: Footprint compatible with MCIO layout. It supports SAS 4.0, PCIe Gen5 / Gen6 with 4X/8X/16X lane options. Terminals include high-speed differential signals, power, ground and auxiliary circuits with broad hardware compatibility.
2.Ultra-high-speed Performance: Supports 32Gbps NRZ and 56G PAM4, and can be upgraded to PCIe 6.0 64G PAM4 with stable long-reach transmission, meeting low-latency mass data exchange among GPU clusters.
3.Controlled SI Performance: Optional 85Ω differential impedance with full shielding structure, which greatly reduces crosstalk and return loss and meets strict high-frequency simulation requirements.
4.Dual Connection Modes: One connector supports both board-edge mating and cable assembly interconnection. Straight, right-angle and 45-degree outlet options fit diverse internal wiring architectures.
5.Ultra-low Profile & High Density: 0.6mm fine pitch. The ULP version achieves only 3.9mm onboard height and can be installed under heat sinks, greatly saving chassis thickness and PCB space for slim high-density equipment.
6.High Mechanical Reliability: Built-in anti-misinsertion and anti-skew locking structure with stable contact and excellent mating cycles. It operates stably from -40℃ to +85℃ with good vibration & EMI resistance for 7×24 continuous data center operation.

Omni Edge 8I STR

OmniEdge high-speed board-to-cable connectors are next-gen ultra-high-density interconnection solutions for AI computing platforms. They are widely deployed inside AI servers, OCP modular hardware, HPC clusters, high-speed storage arrays and GPU accelerator modules. Supporting seamless upgrade from PCIe Gen5 to Gen6, they become the preferred internal interconnect for high-density liquid-cooled data centers.
Product Features:
1.Standard Compatibility: Footprint compatible with MCIO layout. It supports SAS 4.0, PCIe Gen5 / Gen6 with 4X/8X/16X lane options. Terminals include high-speed differential signals, power, ground and auxiliary circuits with broad hardware compatibility.
2.Ultra-high-speed Performance: Supports 32Gbps NRZ and 56G PAM4, and can be upgraded to PCIe 6.0 64G PAM4 with stable long-reach transmission, meeting low-latency mass data exchange among GPU clusters.
3.Controlled SI Performance: Optional 85Ω differential impedance with full shielding structure, which greatly reduces crosstalk and return loss and meets strict high-frequency simulation requirements.
4.Dual Connection Modes: One connector supports both board-edge mating and cable assembly interconnection. Straight, right-angle and 45-degree outlet options fit diverse internal wiring architectures.
5.Ultra-low Profile & High Density: 0.6mm fine pitch. The ULP version achieves only 3.9mm onboard height and can be installed under heat sinks, greatly saving chassis thickness and PCB space for slim high-density equipment.
6.High Mechanical Reliability: Built-in anti-misinsertion and anti-skew locking structure with stable contact and excellent mating cycles. It operates stably from -40℃ to +85℃ with good vibration & EMI resistance for 7×24 continuous data center operation.