D/N:600-2740233-01
DA CEM PCIE GEN5.0,H105.00mm*W8.20mm*H14.30mm
| Assembly Method | Vertical | Pin Count |
| Number of Rows | Single Port | 164 pins |
| CONNECTOR Housing: High Temp LCP + Molded FR Plastic |
| Plating | Nickel + Gold | Terminal Base Material | Phosphor Bronze |
| Terminal Layout | Straight Plug-in | Terminal Shape & Structure | Bow-type spring contact |
| Terminal Plating Specification | Gold plating thickness:Solder area: 0.025 μm Contact area: 0.05 μm |
Terminal Type | / |
| / |
| Packaging Technology | Housing equipped with alignment posts for guided assembly, secured by screws. | ||
| UL Flammability Rating | UL94V-0 | ||
| Packaging Method | Individual packing | ||
| Length | 105 | Width | 8.2 |
| Height | 14.3 | Mating Height | 1.57 |
| Data Rate Requirement | PCIE GEN5 32Gbps |
| Dielectric Withstanding Voltage | 300V DC/min |
| Operating Voltage | 30V DC |
| Connector System | Wire-to-Board |
| Operating Temperature | -40 ℃~+85 ℃ |