Technology Parameters
Material
v Plastic Housings: PPA
v Outer Contact: Zinc Alloy
v Insulator: HTN+30GF
v Center Pin: Copper Alloy
v Reflow Soldering
Electrical Performance
1.1 Impedance: 100 Ω
1.2 Frequency Range: DC to 2 GHz
1.3 Return Loss:
≥ 20 dB to 1 GHz
≥ 17 dB to 2 GHz
1.4 Insertion Loss: ≤ 0.1 dB to 2 GHz
1.5 Insulation Resistance: ≥ 1000 MΩ
1.6 Center Contact Resistance: ≤ 8mΩ
1.7 Test Voltage: 250 V rms
1.8 Working Voltage: 100 V rms
1.9 Contact Current: ≤ 1.5 A DC
2.0 RF-leakage:
75dB,up to 1GHz(IEC 62153-4-7)
65dB,up to 2GHz(IEC 62153-4-7)
Mechanical Performance
2.1 Mating Cycles: ≥ 25 Cycles
2.2 Engagement Force: ≤ 30 N
2.3 Disengagement Force: ≥5 N
2.4 Retention Force Latch: ≥ 110 N
2.5 Temperature Range:- 40°C ~ +105°C
