The ECT R&D center focuses on the design of interconnection solutions. The R&D center’s technical and management team has more than 20 years of RF design experience and is also a member of the China Institute of Communications.

ECT R&D center team has obtained multiple project development funds and industrial application support in Shenzhen. Meanwhile, we has formed a joint project development team with some universities, scientific research units, and customers. We can provide technical support or one-stop solutions based on the existing design framework. Our professional R&D team can develop customized products according to the latest technology. Using CAE FEA (Computer Aided Engineering Finite Element Analysis) to predict and analyze design performance and related issues. The R&D center team focuses on the research and development of miniaturized high-reliability RF connectors and interconnection systems. This project is listed as a major project plan of Shenzhen’s "12^th Five-Year Plan". It has accumulated and possessed expertise in the design and manufacture of micro and ultra-small connectors. With unique experience and superiority, we has achieved many patents so far, including patent certificates from the United States, Europe, Japan and other countries and regions, and developed a full range of products such as MINI RF, USS RF, and SCS RF.

ECT R&D center team has professional RF connector design capabilities and can fulfill the various needs of customers in small or ultra-small applications, and high-precision interconnections.