Technology Parameters
Material
v Plastic Housings: PA46+30%GF
v Outer Contact: Zinc Alloy
v Center Pin: Copper Alloy
v Insulator: HTN+30%GF
v Type A~Type Z: High Temperature Resistance, Reflow Soldering
Electrical Performance
1.1 Impedance: 50 Ω
1.2 Frequency Range: DC to 6 GHz
1.3 Return Loss:
≥ 26dB, DC to 1 Ghz
≥ 24dB, DC to 3 GHz
1.4 Insertion Loss: ≤ 0.1 x √f(GHz) dB@1 GHz
1.5 Insulation Resistance: ≥ 100MΩ
1.6 Center Contact Resistance: 40mΩ Max
1.7 Outer Contact Resistance: 40mΩ Max
1.8 Test Voltage: 800V rms
1.9 Working Voltage: ≤ 60V DC
2.0 Contact Current: ≤ 1 A DC
2.1 RF-leakage: ≥ 65 dB
Mechanical Performance
2.2 Mating Cycles: ≥ 25 Cycles
2.3 Engagement Force: ≤ 25 N
2.4 Center Pin Retention Force: ≥ 10N
2.5 Retention Force Latch: ≥ 110 N
2.6 Temperature Range: -40 °C ~ +105°C
